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CCBLF22701031P

Part number CCBLF22701031P
Product classification Solder
Manufacturer Canfield Technologies
Description BLF 227 NO CLEAN FLUX 1 LB. 031D
Encapsulation
Packing Spool
Quantity 50
RoHS status YES
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$61.8660

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Product parameters
TYPEDESCRIPTION
MfrCanfield Technologies
Series-
PackageSpool
Product StatusACTIVE
Diameter0.031" (0.79mm)
Wire Gauge20 AWG, 22 SWG
CompositionBLF 227 (99.17Sn/.8Cu/.03Ni)
TypeWire Solder
Melting Point440°F (227°C)
FormSpool, 1 lb (453.59g)
ProcessLead Free
Flux TypeNo-Clean
Storage/Refrigeration Temperature50°F ~ 104°F (10°C ~ 40°C)
Shelf Life StartDate of Manufacture
Shelf Life24 Months

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