15815509278
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AGFB023R24C2I1V

Part number AGFB023R24C2I1V
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$28,254.4710

$84,763.4130

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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA

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RES SMD 2.4K OHM 5% 1/8W 0805
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RES SMD 1.5K OHM 5% 1/8W 0805
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RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 2POS
Sullins Connector Solutions
CONN HEADER R/A 2POS
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