15815509278
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W66BP6NBHAFJ

Part number W66BP6NBHAFJ
Product classification Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4, X16, 1600MHZ, -40C~1
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$6.3630

$6.3630

10

$5.7435

$57.4350

25

$5.4810

$137.0250

80

$4.7565

$380.5200

230

$4.5465

$1,045.6950

440

$4.1475

$1,824.9000

945

$3.6120

$3,413.3400

2400

$3.4755

$8,341.2000

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Product parameters
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TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case100-VFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package100-VFBGA (10x7.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization128M x 16

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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