15815509278
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W66BP2NQUAHJ

Part number W66BP2NQUAHJ
Product classification Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4, DDP, X32, 2133MHZ, -
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$7.5705

$7.5705

10

$6.8355

$68.3550

25

$6.5205

$163.0125

80

$5.6595

$452.7600

230

$5.4075

$1,243.7250

440

$4.9350

$2,171.4000

945

$4.2945

$4,058.3025

2400

$4.1370

$9,928.8000

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Product parameters
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TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 32

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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