15815509278
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V5314

Part number V5314
Product classification Adhesives, Epoxies, Greases, Pastes
Manufacturer ASSMANN WSW Components
Description THERMAL COMPOUND
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Product parameters
TYPEDESCRIPTION
MfrASSMANN WSW Components
Series-
PackageBulk
Product StatusACTIVE
Size / Dimension25 kg Container
TypeThermal Compound, Thermal Grease
Thermal Conductivity0.80W/m-K
Storage/Refrigeration Temperature32°F ~ 104°F (0°C ~ 40°C)
Shelf Life36 Months
Usable Temperature Range-40°F ~ 302°F (-40°C ~ 150°C)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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