15815509278
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TH833-3_0.5_0.5

Part number TH833-3_0.5_0.5
Product classification Adhesives, Epoxies, Greases, Pastes
Manufacturer Penchem Technologies Sdn Bhd
Description Silicone thermal conductive pott
Encapsulation
Packing Bottle
Quantity 19
RoHS status YES
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$157.5000

$157.5000

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TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH833-3
PackageBottle
Product StatusACTIVE
ColorGray, White
Size / Dimension500 gram Jar
TypeSilicone Compound, 2 Part
Thermal Conductivity2.0W/m-K
Shelf Life StartDate of Manufacture
Shelf Life12 Months
Usable Temperature Range-40°F ~ 392°F (-40°C ~ 200°C)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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