15815509278
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TH235-2-500G-JAR

Part number TH235-2-500G-JAR
Product classification Adhesives, Epoxies, Greases, Pastes
Manufacturer Penchem Technologies Sdn Bhd
Description NON SILICONE THERMAL PUTTY
Encapsulation
Packing Bottle
Quantity 6
RoHS status YES
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$88.1685

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TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH235-2
PackageBottle
Product StatusACTIVE
ColorBlue
Size / Dimension500 gram Container
TypeNon-Silicone Putty
Thermal Conductivity4.00W/m-K
Shelf Life18 Months
Usable Temperature Range5°F ~ 248°F (-15°C ~ 200°C)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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