15815509278
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TC58BYG1S3HBAI6

Part number TC58BYG1S3HBAI6
Product classification Memory
Manufacturer Toshiba Memory America, Inc. (Kioxia America, Inc.)
Description IC FLASH 2GBIT PARALLEL 67VFBGA
Encapsulation
Packing Tray
Quantity 338
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$4.0005

$4.0005

10

$3.6330

$36.3300

25

$3.5490

$88.7250

40

$3.5385

$141.5400

80

$3.1710

$253.6800

338

$3.1605

$1,068.2490

676

$3.0450

$2,058.4200

1014

$2.8875

$2,927.9250

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TYPEDESCRIPTION
MfrToshiba Memory America, Inc. (Kioxia America, Inc.)
SeriesBenand™
PackageTray
Product StatusACTIVE
Package / Case67-VFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.7V ~ 1.95V
TechnologyFLASH - NAND (SLC)
Memory FormatFLASH
Supplier Device Package67-VFBGA (6.5x8)
Write Cycle Time - Word, Page25ns
Memory InterfaceParallel
Access Time25 ns
Memory Organization256M x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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