15815509278
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TC58BYG0S3HBAI6

Part number TC58BYG0S3HBAI6
Product classification Memory
Manufacturer Toshiba Memory America, Inc. (Kioxia America, Inc.)
Description IC FLASH 1GBIT PARALLEL 67VFBGA
Encapsulation
Packing Tray
Quantity 27
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$3.2550

$3.2550

10

$2.9295

$29.2950

25

$2.8770

$71.9250

40

$2.8770

$115.0800

80

$2.5725

$205.8000

338

$2.4885

$841.1130

676

$2.4780

$1,675.1280

1014

$2.3100

$2,342.3400

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TYPEDESCRIPTION
MfrToshiba Memory America, Inc. (Kioxia America, Inc.)
SeriesBenand™
PackageTray
Product StatusACTIVE
Package / Case67-VFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.7V ~ 1.95V
TechnologyFLASH - NAND (SLC)
Memory FormatFLASH
Supplier Device Package67-VFBGA (6.5x8)
Write Cycle Time - Word, Page25ns
Memory InterfaceParallel
Access Time25 ns
Memory Organization128M x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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