15815509278
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S1C31D01D101000

Part number S1C31D01D101000
Product classification Microcontrollers
Manufacturer Epson Electronics America Inc-Semiconductor Div
Description IC MCU 32BIT 256KB FLASH CHIP
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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1320

$4.7565

$6,278.5800

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TYPEDESCRIPTION
MfrEpson Electronics America Inc-Semiconductor Div
Series-
PackageTray
Product StatusACTIVE
Package / CaseDie
Mounting TypeSurface Mount
Speed21MHz
Program Memory Size256KB (256K x 8)
RAM Size96K x 8
Operating Temperature-40°C ~ 85°C
Oscillator TypeExternal, Internal
Program Memory TypeFLASH
Core ProcessorARM® Cortex®-M0+
Data ConvertersA/D 8x12b SAR
Core Size32-Bit
Voltage - Supply (Vcc/Vdd)1.8V ~ 5.5V
ConnectivityI2C, IrDA, QSPI, SPI, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device PackageChip
Number of I/O57
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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