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JET551AX30T5

Part number JET551AX30T5
Product classification Solder
Manufacturer Chip Quik, Inc.
Description JET PRINTING SOLDER PASTE SN63/P
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$96.5475

$96.5475

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TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesCHIPQUIK®
PackageBulk
Product StatusACTIVE
CompositionSn63Pb37 (63/37)
TypeSolder Paste
Melting Point361°F (183°C)
FormSyringe, 3.53 oz (100g)
ProcessLeaded
Flux TypeNo-Clean
Shelf Life StartDate of Manufacture
Shelf Life12 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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