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IPC0209-S

Part number IPC0209-S
Product classification Solder Stencils, Templates
Manufacturer Chip Quik, Inc.
Description POWERQSOP-28 (0.635 MM PITCH 9.9
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$13.5765

$13.5765

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Product parameters
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesProto-Advantage IPC
PackageBulk
Product StatusACTIVE
MaterialStainless Steel
Pitch0.025" (0.64mm)
TypePowerQSOP
Inner Dimension0.390" L x 0.154" W (9.90mm x 3.90mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad0.287" L x 0.087" W (7.29mm x 2.20mm)
Number of Positions28

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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