15815509278
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HDTM-6-08-1-S-VT-4-L-1-A

Part number HDTM-6-08-1-S-VT-4-L-1-A
Product classification Specialized
Manufacturer Samtec, Inc.
Description XCEDE HD 1.80 MM HIGH-DENSITY BA
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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Product parameters
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TYPEDESCRIPTION
MfrSamtec, Inc.
SeriesXcede® HDTM
PackageBulk
Product StatusACTIVE
FeaturesBoard Guide, Guide Pin
Connector TypeHeader, Male Blades
Contact FinishGold
ColorBlack
Mounting TypeThrough Hole
Number of Positions128
Pitch0.071" (1.80mm)
Operating Temperature-40°C ~ 105°C
Number of Positions LoadedAll
TerminationPress-Fit
Connector UsageBackplane
Connector StyleXCede®, Guide Left
Number of Columns8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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