15815509278
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HDTF-3-08-S-RA-LC-100

Part number HDTF-3-08-S-RA-LC-100
Product classification Specialized
Manufacturer Samtec, Inc.
Description XCEDE HD 1.80 MM HIGH-DENSITY BA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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$15.5610

$653.5620

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Product parameters
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TYPEDESCRIPTION
MfrSamtec, Inc.
SeriesXcede® HDTF
PackageTray
Product StatusACTIVE
Connector TypeReceptacle, Female Sockets
Contact FinishGold
ColorBlack
Voltage Rating48VAC
Mounting TypeThrough Hole, Right Angle
Number of Positions48
Pitch0.071" (1.80mm)
Number of Rows6
Operating Temperature-40°C ~ 105°C
Number of Positions LoadedAll
TerminationPress-Fit
Connector UsageBackplane
Connector StyleXCede®
Contact Finish Thickness50.0µin (1.27µm)
Number of Columns8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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