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H2F1.58BK25

Part number H2F1.58BK25
Product classification Heat Shrink Fabric
Manufacturer Techflex
Description 2:1 FAB HEATSHRINK BLK 40MM 25'
Encapsulation
Packing Spool
Quantity 0
RoHS status YES
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$67.8720

$67.8720

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TYPEDESCRIPTION
MfrTechflex
SeriesShrinkflex
PackageSpool
Product StatusACTIVE
ColorBlack
Length25.00' (7.62m)
Diameter - Inner, Supplied1.57" (39.9mm)
Diameter - Inner, Recovered0.79" (20.1mm)
Shrinkage Ratio2 to 1

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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