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GD25B256EYIGY

Part number GD25B256EYIGY
Product classification Memory
Manufacturer GigaDevice
Description IC FLASH 256MBIT SPI/QUAD 8WSON
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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4800

$2.3310

$11,188.8000

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Product parameters
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TYPEDESCRIPTION
MfrGigaDevice
SeriesGD25B
PackageTray
Product StatusACTIVE
Package / Case8-WDFN Exposed Pad
Mounting TypeSurface Mount
Memory Size256Mbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NOR (SLC)
Memory FormatFLASH
Supplier Device Package8-WSON (6x8)
Memory InterfaceSPI - Quad I/O
Memory Organization32M x 8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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