15815509278
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BML2-25-12

Part number BML2-25-12
Product classification Lugs
Manufacturer Panduit Corporation
Description COMPRESSION CONN FOR WIRE ALUM
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Product parameters
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TYPEDESCRIPTION
MfrPanduit Corporation
SeriesBML2
PackageBulk
Product StatusOBSOLETE
Mounting TypeFree Hanging (In-Line)
Wire Gauge4 AWG
InsulationNon-Insulated
Terminal TypeRing
Stud/Tab Size12 Stud
Length - Overall3.543" (90.00mm)
TerminationCrimp
Width - Outer Edges0.944" (24.00mm)
Tab Thickness0.157" (4.00mm)
Contact MaterialCopper
Terminal StyleSingle Stud Hole
Diameter - Barrel ID0.280" (7.11mm)
Diameter - Barrel OD0.630" (16.00mm)
Diameter - Ring ID0.512" (13.00mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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