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AS4C512M16D3LC-10BINTR

Part number AS4C512M16D3LC-10BINTR
Product classification Memory
Manufacturer Alliance Memory, Inc.
Description DRAM
Encapsulation
Packing Tape & Reel (TR)
Quantity 0
RoHS status YES
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2000

$17.4405

$34,881.0000

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Product parameters
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TYPEDESCRIPTION
MfrAlliance Memory, Inc.
Series-
PackageTape & Reel (TR)
Product StatusACTIVE
Package / Case96-TFBGA
Mounting TypeSurface Mount
Memory Size8Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)
Voltage - Supply1.283V ~ 1.45V
TechnologySDRAM - DDR3L
Clock Frequency933 MHz
Memory FormatDRAM
Supplier Device Package96-FBGA (9x13)
Write Cycle Time - Word, Page15ns
Memory InterfaceParallel
Access Time20 ns
Memory Organization512M x 16

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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