15815509278
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311

Part number 311
Product classification Prototype Boards Perforated
Manufacturer Serpac Electronic Enclosures
Description BREADBRD PREPUNCHED INSULAT NPTH
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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TYPEDESCRIPTION
MfrSerpac Electronic Enclosures
Series-
PackageBulk
Product StatusOBSOLETE
Size / Dimension1.76" L x 1.28" W (44.7mm x 32.5mm)
Pitch0.100" (2.54mm)
Board Thickness0.062" (1.58mm)
Proto Board TypeBreadboard, Prepunched Insulating
Hole Diameter0.038" (0.97mm)
PlatingNon-Plated Through Hole (NPTH)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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