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10153311-004TLF

Part number 10153311-004TLF
Product classification Inline Module Sockets
Manufacturer Storage & Server IO (Amphenol Communications Solutions)
Description DDR4 SO DIMM
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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Total number

Quantity

Price

Total price

1728

$6.6150

$11,430.7200

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Product parameters
TYPEDESCRIPTION
MfrStorage & Server IO (Amphenol Communications Solutions)
Series-
PackageTray
Product StatusACTIVE
FeaturesBoard Guide, Latches, Solder Retention
Contact FinishGold
ColorBlack
Mounting TypeThrough Hole
Memory TypeDDR4 SDRAM
Height0.571" (14.50mm)
Card Thickness0.047" (1.20mm)
Connector StyleSODIMM
Contact Finish Thickness15.0µin (0.38µm)
Mounting FeatureNormal, Standard - Top
Number of Positions260

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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