2001 Sep 27 Rev.1 2 www.phycomp-components.com
Phycomp Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for
Bluetooth and WLAN IEEE 802.11b
FEATURES
• Designed for 2.45 GHz ISM-band
• Simplifies antenna circuitry
• NiSn lead-free terminations
• suitable for wave and reflow
soldering
• Supplied in tape on reel.
APPLICATIONS
• Telecommunications
• Computing (PCs, printers, PDAs)
• Wireless office data
communications including WLAN
• Consumer electronics (wireless
headphones).
DESCRIPTION
This 2.45 GHz ceramic multilayer
antenna has been designed to meet
the requirements of the Bluetooth
TM(1)
and IEEE 802.11b wireless
communications protocol. It consists
of a rectangular block of low-dielectric
ceramic material and is fabricated in a
water-based non-toxic process. The
antenna is capable of providing good
connectivity using near 50 Ω
microstrip directly onto the PC board.
(1) Bluetooth is a trademark owned by
Telefonieaktiebolaget L M Ericsson,
Sweden.
ENVIRONMENTAL CARE
The foil making process
uses an environment-
friendly aqueous-solvent
technology that fully
complies with today’s green-product
design requirements. All terminations
are lead-free. Packing materials can
be recycled.
QUICK REFERENCE DATA
DESCRIPTION VALUE
Center frequency 2.45, 2.60 and 2.70 GHz
Bandwidth 100 MHz
Gain 1.2 dBi max.
VSWR 2 max.
Polarization Linear
Azimuth beamwidth Omni-directional
Impedance 50 Ω
Power dissipation 1 W
Operating temperature −55 to +125 °C
Terminations NiSn
Resistance to soldering heat 260 °C for 10 s
Weight 0.16 g
2001 Sep 27 Rev.1 3 www.phycomp-components.com
Phycomp Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for
Bluetooth and WLAN IEEE 802.11b
MECHANICAL DATA
Physical dimensions
Table 1
Antenna dimensions
Note
1. The antenna has built-in circuitry to the ground termination. Connecting the antenna’s ground point to the system’s
RF ground plane is optional. If good matching is achieved, the ground termination is then used as a solder joint (like
S1, S2, S3, and S4) to fix the antenna to the substrate only.
Device marking
LWT FGCS
1
S
2
S
3
S
4
–––
feed
termination
optional
1)
ground
termination
–
NC
solder
termination
NC
solder
termination
NC
solder
termination
NC
solder
termination
Dimensions in millimetres
7.35
±
0.25 5.5
±
0.2 1.3
±
0.2 0.9
±
0.25 1.25
±
0.35 0.5 ±0.3 1.25
±
0.35 1.25
±
0.35 0.9
±
0.25 1.25
±
0.35
CENTER
FREQUENCY
(GHZ)
MARKING
CODE
2.45 no marking
2.60 6
2.70 7
HBK016
S
2
S
1
S
4
S
3
W
C
G
F
S
1
G
F
T
L
S
4
S
2
S
3
C
Dimensions in mm
Fig.1 Dimensional outline.
For dimensions see Table 1.
