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多芯片封装
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W25M02GWZEIGS
W25M02GWZEIGS
：
W25M02GWZEIGS
：
Multichip Packages
：
Winbond
：
Multichip Packa
：
-
：
：
NO
TYPE
DESCRIPTION
Manufacturer:
Winbond
Product Category:
Multichip Packages
Brand:
Winbond
Product Type:
Multichip Packages
Subcategory:
Memory & Data Storage
PDF(1)
480
9.68
4646.4
RENESAS
R5F100FEAFP
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RENESAS
R5F10BGELFB#H5
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RENESAS
R7FA2A1AB3CFM#AA0
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RENESAS
R7FA2E1A53CFJ#AA0
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RENESAS
R7FA2E1A72DFM#AA0
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RENESAS
R7FA6M1AD3CFM#AA0
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RENESAS
R7S910018CBG#AC0
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RENESAS
R7FA2L1AB2DFP#AA0
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RENESAS
R5F100LGAFB
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RENESAS
R7F0C907B2DFP-C#AA0
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Diodes Incorporated
PI3PCIE3413ZHE
IC PCIE 3:1 MUX/DEMUX SW 42TQFN
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Texas Instruments
BQ2201SNTR
IC SRAM NONVOLATILE CNTRLR 8SOIC
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Efinix, Inc.
T120F324C4
IC FPGA 130 I/O 324FBGA
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Efinix, Inc.
T13F169I4
IC FPGA 73 I/O 169FBGA
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Bulgin
FX0380
Fuse Holder IN-LINE FUSE HLDR 5X20mm
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Winbond
W25M02GWZEIGS
Multichip Packages
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Analog Devices Inc.
AD7249ARZ
IC DAC 12BIT V-OUT 16SOIC
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Surge
C42P2473K30C000
C42 Series 275 V 0.047 uF ±10% LS=7.5mm Radial Metallized Polypropylene Cap
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TE Connectivity
42068
22-18 AWG F CRIMP BRASS FASTON 110 RECEPTACLE
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Thermalloy
6278B
HEATSINK TO-202 LOW PROFILE
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295144934@qq.com
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