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3M
EMI/EMC Electronic Materials
Solutions
Electronics
EMI Shielding Tapes
EMI Grounding Adhesives and Gaskets
EMI Absorbers
Flux Field Directional Materials
NFC, Wireless Power, Magnetic Shielding Materials
for Today’s
2
Laptop EMI/EMC Solutions
3M Multi-functional EMI
Shielding, Grounding and Heat
Spreading Solutions for LED
and other heat sources device
temperature management
3M
EMI Absorbers
AB5050/AB6005/AB7050
to reduce EMI Noise level within
device or on Flex/Connector
3M
Electrically Conductive
Adhesive Transfer Tape
9707/9709S/9720S/9750
for Flex/PCB grounding and
attachment, grounded parts assembly
versus screws and clips. Lower device
bias, reduce flex EMI interference.
3M EMI Absorbers AB5050/
AB6005/AB7050 to reduce
the EMI noise radiation from
high speed devices like CPU/
MPU/memory. Attach AB
series sheet on the specific
noise source.
3M
Electrically
Conductive Gasket
ECG-7073 for grounding
and EMI shielding.
End user device
using NFC/RFID
Antenna & 3M Flux
Field Directional
Material (FFDM)
Read
Antenna
Very soft and conformable 3M
Electrically
Conductive Foam Gasket Materials
MSG-6100 for grounding, gap filling
and EMI shielding
3M
EMI Shielding Foil
and Fabric Tape for
display grounding and
EMI Shielding
LCD Driver EMI Shielding
3M EMI Shielding Foil
Tapes 1170 and 1183
3M EMI Shielding Fabric
Tapes CN3490, CN3190
and CEF-3T
3M EMI Absorbers AB7050/AB5100 to reduce
EMI noise within enclosure / EMI Faraday Cage /
Reduce cavity resonance. Attach absorber sheet
on the wall of shielding parts.
3M
Flux Field Directional Materials
EM16TF/RFIC15
for improved NFC & RFID antenna
read range performance.
Less eddy current losses
in surrounding materials.
LCD Module Back Side
Control PCB
Cover Sheet
WI-WAN
Antenna
AB5010
Easy-to-use shielding, absorbing, grounding
and bonding technology for today’s electronics
The continuing trend toward designing electronic devices with smaller
enclosures, denser circuits and higher speeds has made managing
electromagnetic/radio frequency interference (EMI/RFI) and electrostatic
discharge (ESD) a growing challenge for electronics manufacturers.
3M can help you meet that challenge, with a variety of advanced shielding
and grounding solutions designed to help you speed assembly time
reduce weight…save spacecontrol costs…and give you more design
flexibility. Let 3M help you get connected!
3M EMI Absorbers AB5100/AB7050
to reduce the EMI interference between
LCD back panel and Wi-LWAN antenna
11
Product Backing Adhesive
Total
Thickness
mils (mm)
Features
3M
Metallized Cloth
2191FR
Nickel on copper-plated
polyester ripstop fabric
Acrylic Conductive
5.5
(0.140 )
Lightweight, conformable, oxidation resistant and high strength for
EMI shielding and grounding. Easily die cut.
AG-0927
Silver-coated polyester
fabric
Acrylic Conductive
4.3
(0.110 )
Lightweight, conformable, oxidation resistant and high strength for
EMI shielding and grounding. Easily die cut.
AU-2190
Gold-coated polyester
fabric
Acrylic Conductive
4.3
(0.110 )
Lightweight, conformable, oxidation resistant and high strength for
EMI shielding and grounding. Easily die cut.
X-7001
Copper-plated polyester
ripstop fabric
Acrylic Conductive
Coated on Both Sides
4.3
(0.110 )
Typically used to bond two surfaces, both physically and electrically.
Also can provide EMI shielding, static charge draining, grounding.
Lightweight, conformable and easily die cut.
CN 3190
Nickel on copper-plated
polyester ripstop fabric
Acrylic Conductive
4.3
(0.110 )
Lightweight, conformable, oxidation
resistant and high strength for EMI shielding and grounding.
CN3490
Non-woven
copper-nickel fabric
Acrylic Conductive
2.4
(.06)
Lightweight, thin, conformable non-woven fabric. Ideal for shielding,
grounding, and static dissipation. Easily die cut.
CN4490
Non-woven
copper-nickel fabric
Double Coated
Acrylic Conductive
2.0
(.05)
Double coated with adhesive. Lightweight, thin, conformable non-
woven fabric. Ideal for shielding, grounding, and static dissipation.
Ideal for use as a thin, conductive, repositionable gasket material.
Easily die cut.
CEF-6** Cu/Ni plated fabric
Acrylic Conductive
coated on both sides
5.5
(0.14)
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
CEF-6R ** Cu/Ni plated fabric
Acrylic Conductive
coated on both sides
4.7
(0.12 )
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
CEF-1** Cu/Ni plated fabric Acrylic Conductive
4.3
(0.11)
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
CEF-3** Cu/Ni plated fabric Acrylic Conductive
4.7
(0.12 )
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
CEF-8** Cu/Ni plated fabric
Acrylic Conductive
coated on both sides
3.0
(0.075)
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
CEF-3T**
CEF-3B**
Cu/Ni plated fabric Acrylic Conductive
2.4 (0.06)
Grey
2.4 (0.06)
Black
Bonding and grounding two surfaces. EMI shielding, static discharge
draining. Flexible and conformable design.
3M
EMI Shielding Sheets and Films
CU-10S**
Epoxy FR film
+ copper foil
None
6.7
(0.170 )
Softened copper foil with flame-retardant film on one side. Excellent
EMI shielding for PCBs and assemblies. Lightweight, flexible and
easily die cut.
**Products are special order in the USA. Please contact your 3M sales support for details.
3M offers a wide range of EMI/RFI
shielding tapes and absorbing materials,
mesh and sleeving products, gaskets and
conductive materials.
3M EMI/EMC Solutions
Foil and Fabric Tapes
Hard Coating Layer
ITO Layer
LCD Glass
Driver LC
AL39UL
EMI Custom Foil Tape Solutions
• Shielding
• Grounding
• ESD Protection
• Conformability
• Ease of use in assembly
• Customized thickness
* For 3M custom solutions please contact your
local 3M product specialist. Products are
special order. AL39UL and 3006ALB.
Customized XY and XYZ Foil & Fabric Tape Options
Typical Product Constructions
Type 30 Adhesive
Nonwoven Embedded
Adhesive
Black/Copper Foil
Release Liner
3006CUBC
Black PET/AL Foil Laminate
Release Liner
AL39UL
XY-axis Conductivity XYZ-axis Conductivity

Power Integrations
INN3163C Series 650 V 100 kHz Off-Line CV/CC QR Flyback Switcher IC - InSOP-24D
Yamaichi Electronics
Automotive Grade MXM3.1 Type B Connector Card Edge Connector
Hirose Electric
MS-156 Serie Plug Straight Panel Mount Adaptor / SMA Jack
TE Connectivity
Valox 50 Ohm Straight Jack Solder Coaxial Cable BNC Connector
TE Connectivity
64 Position 1.00 mm Dual Row Board to Board SMT Receptacle Connector
Sullins
120 Position ( 2 x 60 ) 2.54 mm Dip Solder Dual Readout Edgecard Connector
TE Connectivity
Standard Edge II Card Edge, 18dual pos, 2.54 centerline
Maxim Integrated
16-Channel (Two Banks of 8-Channel), High-Voltage Analog Switches
Bussmann / Eaton
Circuit Protection Kits RK1SK-39
Walsin Technology Corporation
WR06 Series 15 KOhm ±5% 1/10 W 0603 SMT Thick Film Chip Resistor
Vishay
CRCW Series 0402 0.063 W 806 Ohm ±1 % ±100 ppm/K SMT Thick Film Chip Resistor
Infineon Technologies
IGBT Modules HYBRID PACK 1
Infineon Technologies
IGBT Transistors DISCRETE SWITCHES
Infineon Technologies
IGBT Transistors LOW POWER ECONO
STMicroelectronics
Audio Amplifiers 4 x 52 W quad bridge power amplifier low volt operation
Kyocera AVX
Varistors 18VAC 26VDC 0.1J 120pF 34.5 V 60V
KEMET
Varistors 45V 1000A 2220 AEC-Q200
Littelfuse
Varistors 10 VAC 1.5J 36V-CLAMP 500A-PK
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