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P461

  • P461
  • P461
P461
THYRISTOR
SGS Thomson
THYRISTOR MODUL
-
YES
ADVANCEINFORMATION
SCL
V+
D+
D
GNDA0
SMBus
Controller
Host Processor
A1
Overtemperature
Shutdown
SDA
GND
GND
1.7 V to 3.6 V
1.7 V to 3.6 V
GND
Built-in
Thermal
Transistor
or Diode
FPGA, ADC,
DAC, or ASIC
THERM
ALERT/
THERM2
TMP461-SP
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5 6
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Copyright © 2017, Texas Instruments Incorporated
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
TMP461-SP
SBOS902 SEPTEMBER 2017
TMP461-SP Radiation Hardened Remote and Local Digital Temperature Sensor
1
1 Features
1
Remote Diode Temperature Sensor Accuracy:
±1.5°C
Local Temperature Sensor Accuracy: ±2°C
Resolution for Local and Remote Channels:
0.0625°C
Supply and Logic Voltage Range: 1.7 V to 3.6 V
35-µA Operating Current (1 SPS),
3-µA Shutdown Current
Series Resistance Cancellation
η-Factor and Offset Correction
Programmable Digital Filter
Diode Fault Detection
Two-Wire and SMBus™ Serial Interface
Compatible with Pin-Programmable Address
QMLV Qualified: 5962L1721801VXC
Thermally Enhanced HKU Package
Radiation Hardness Assured (RHA) up to Total
Ionizing Dose (TID) 50 kRad (Si)
Single Event Latchup (SEL) Immune to 76
MeV.cm
2
/mg at 125°C
10-Lead HKU Ceramic Package
2 Applications
Spacecraft FPGA, ADC's, DAC's, and ASIC
Temperature Monitoring
Spacecraft Housekeeping and Telemetry
Simplified Block Diagram
3 Description
The TMP461-SP device is a radiation-hardened,
high-accuracy, low-power remote temperature sensor
monitor with a built-in local temperature sensor. The
remote temperature sensors are typically low-cost
discrete NPN or PNP transistors, or substrate thermal
transistors or diodes that are integral parts of
microprocessors, analog-to-digital converters
(ADC's), digital-to-analog converters (DAC's),
microcontrollers, or field-programmable gate arrays
(FPGAs). Temperature is represented as a 12-bit
digital code for both local and remote sensors, giving
a resolution of 0.0625°C. The two-wire serial interface
accepts the SMBus communication protocol with up
to nine different pin-programmable addresses.
Advanced features such as series resistance
cancellation, programmable nonideality factor (η-
factor), programmable offset, programmable
temperature limits, and a programmable digital filter,
are combined to provide a robust thermal monitoring
solution with improved accuracy and noise immunity.
The TMP461-SP is ideal for multi-location, high-
accuracy temperature measurements in a variety of
distributed telemetry applications. The integrated
local and remote temperature sensors simplify
spacecraft housekeeping activities by providing an
easy way of measuring temperature gradients. The
device is specified for operation over a supply voltage
range of 1.7 V to 3.6 V, and a temperature range of
–55°C to 125°C.
Device Information
(1)
PART NUMBER GRADE PACKAGE
5962L1721801VXC
QMLV RHA
[50 kRad]
10-lead CFP [HKU]
7.02 mm × 6.86 mm
TMP461HKU/EM
(2)
Engineering
Samples
10-lead CFP [HKU]
7.02 mm × 6.86 mm
TMP461EVM-CVAL
Ceramic Evaluation
Board
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
(2) These units are intended for engineering evaluation only.
They are processed to a noncompliant flow and are
functionally tested at 25°C only. These units are not suitable
for qualification, production, radiation testing or flight use.
Parts are not warranted for performance over the full MIL
specified temperature range of –55°C to 125°C or operating
life.
ADVANCEINFORMATION
2
TMP461-SP
SBOS902 SEPTEMBER 2017
www.ti.com
Product Folder Links: TMP461-SP
Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated
4 Device and Documentation Support
4.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.3 Trademarks
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com
27-Oct-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TMP461HKU/EM ACTIVE CFP HKU 10 25 TBD AU N / A for Pkg Type 25 to 25 TMP461HKU/EM
EVAL ONLY
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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