MT29GZ5A5BPGGA-53AAT.87J | Micron | - | Packaging: Reel | Multichip Packages MASSFLASH/LPDDR4 8G | 42.7 | |||
W25M512JVFIQ | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector | 13.32 | |||
S71KS512SC0BHB000 | Cypress Semiconductor | - | FBGA-24 | Multichip Packages Nor |
DataSheet
|
43.1 | ||
MT29VZZZCDA1SKPR-046 W.181 | Micron | - | Packaging: Reel | Multichip Packages UMCP 2112G TFBGA | 265.7 | |||
MT29AZ5A3CHHTB-18AAT.109 TR | Micron | - | VFBGA-162 | Multichip Packages MASSFLASH/LPDDR2 6G | 26.76 | |||
MT29VZZZCD9FQKPR-046 WJ.G9L | Micron | - | Packaging: | Multichip Packages uMCP 1088G | 218.7 | |||
W25M512JVFIQ TR | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector | 13.44 | |||
W25M121AWEIT | Winbond | - | 128 Mbit, 1 Gbit | Multichip Packages 1Gb Serial NAND flash 1.8V + 128Mb Serial Flash 1.8V MCP | 11.34 | |||
W25M512JVCIQ TR | Winbond | - | TFBGA-24 | Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector |
DataSheet
|
10.2 | ||
W71NW20GD3DW | Winbond | - | 2 Gbit, 1 Gbit | Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR1 MCP x8/x32 | 15.6 | |||
W25M512JVFIM | Winbond | - | SOIC-16 | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR |
DataSheet
|
10.62 | ||
W25M512JVFIM TR | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR | 9.52 | |||
W25M512JWEIQS | Winbond | - | Multichip Packages | 11.3 | ||||
W25M02GWTCIT | Winbond | - | 2 Gbit | Multichip Packages 2G-bit Serial NAND flash, 1.8V | 10.62 | |||
W25M512JVBIM TR | Winbond | - | TFBGA-24 | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR |
DataSheet
|
10.18 | ||
W25M02GWTBIT TR | Winbond | - | 2 Gbit | Multichip Packages 2G-bit Serial NAND flash, 1.8V | 10.14 | |||
W71NW20GF3FW | Winbond | - | 2 Gbit, 1 Gbit | Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32 | 17.48 | |||
W25M512JVCIM TR | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR | 10.18 | |||
W25M512JWBIM | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR | 11.58 | |||
W71NW10GE3FW | Winbond | - | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32 | 13.62 | ||||
W25M512JWCIM | Winbond | - | 512 Mbit | Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR | 11.58 | |||
MT29AZ2B2BHGTN-18IT.110 | Micron | - | 2 Gbit | Multichip Packages MASSFLASH/LPDDR2 2G | - | |||
MT29AZ5A5CHGSQ-18IT.87U | Micron | - | 8 Gbit | Multichip Packages MASSFLASH/LPDDR2 8G VFBGA | - | |||
MT29AZ2B1BHGTN-18IT.111 | Micron | - | 1.5 Gbit | Multichip Packages MASSFLASH/LPDDR2 1.5G | - | |||
IS71LD16320WP128-3BPLI_ | ISSI | - | 128 Mbit, 512 Mbit | Multichip Packages LPDDR2+Serial NOR,IT 333MHz,512mb(x16bit) | 16.48 |